The speaker starts by welcoming attendees to Compex 2024 in Taipei, highlighting the new Ryzen 9,000 CPUs that are the fastest consumer PC processors in the world. These CPUs are built on the AM5 platform with support for the latest IO and memory technologies such as PCIE 5 and DDR5. The speaker discusses the new Zen 5 core architecture, which includes improvements in branch prediction accuracy, reduced latency, wider CPU engine, and enhanced AI performance with AVX-512 throughput. The Ryzen 9,950X is introduced as the top-of-the-line CPU with 16 Zen 5 cores, 32 threads, and high clock speeds, delivering best-in-class gaming performance.
The speaker emphasizes AMD’s commitment to longevity and upgradeability by supporting Socket AM5 processors through 2027 and beyond. They announce the upcoming release of 12, 8, and 6-core versions of the Zen 5 CPUs to cater to mainstream price points. The emphasis is on providing performance leadership and accessibility across different product ranges. AMD also introduces the third-gen Ryzen AI processors, which offer significant improvements in compute and AI performance, particularly aimed at copilot PCs for ultra-thin and premium notebooks.
AMD showcases the new Ryzen AI Series processors, including the STRIX processor with N5 CPU, RDNA 3.5 graphics, and XD NNA 2 NPU, delivering high-computing performance for ultrathin notebooks. The focus is on bringing together the best technologies in one chip to enhance AI experiences at low power consumption. The AMD Ryzen AI Series processors are positioned as the most integrated and efficient technology for AI applications and workloads across various software platforms.
HP’s president and CEO, Enrique Lores, introduces the latest products powered by the new AMD Ryzen AI 300 series, emphasizing the incorporation of 50 TOPS of integrated AI performance. HP showcases the new generation of Omnicebook, integrating the latest AMD technology to deliver exceptional user experiences. Lenovo’s president of Intelligent Devices Group, Luca Rossi, reveals a new Yoga laptop powered by third-gen Ryzen AI, showcasing a significant leap in AI computing for Lenovo devices and exclusive AI features.
Johnny She, chairman of ASUS, unveils a range of cutting-edge laptops powered by third-gen AMD Ryzen AI processors, highlighting the superior computing and AI performance with 50 TOPS and advanced MBXFi architecture. ASUS demonstrates the capability of the third-gen Ryzen AI systems to deliver personalized computing experiences for content creators, gamers, and business professionals. ASUS will make these systems available for purchase in July, setting a new standard for AI performance in laptops.
AMD presents a preview of the upcoming fifth-gen EPYC processor, codenamed Tourn, featuring 192 cores and 384 threads built on advanced process technology. Tourn extends EPYC’s leadership in general-purpose and high-performance computing workloads, showcasing its performance in scientific simulations and AI inferencing tasks. The speaker demonstrates Tourn’s superiority in handling multiple LAMA two virtual assistants with faster response times and higher performance throughput compared to the competition. Tourn is set to launch in the second half of the year, promising groundbreaking performance for enterprise deployments.
